Raised Access Flooring

Revision 2 · SynC Standards Team — Specifier, SynC (SynC Platform Team / Platform Standards) ✓ Official · Jun 12, 2026 +5 −5

Fix cross-reference library prefix syncs/ -> sync/
Showing changes from Rev 1 to Rev 2 in Raised Access Flooring.
---
title: Raised Access Flooring
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Not intended for: low-profile cable management trays integral to carpet
underlayment, structural concrete slabs, resilient or carpet finishes applied
directly to slab (see [[syncs/resilient-flooring]] and [[syncs/carpet]]), or
computer room cooling equipment (see [[syncs/computer-room-air-conditioning]]).
+ directly to slab (see [[sync/resilient-flooring]] and [[sync/carpet]]), or
+ computer room cooling equipment (see [[sync/computer-room-air-conditioning]]).
---
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## Where the underfloor space is used as a supply air plenum for underfloor air distribution, the airflow performance and air-sealing requirements of this standard apply in addition to the structural requirements.
## Where the understructure is used as a signal reference grid or as an equipment grounding path, the grounding and bonding requirements of [[syncs/grounding-and-bonding]] apply in addition to this standard.
+## Where the understructure is used as a signal reference grid or as an equipment grounding path, the grounding and bonding requirements of [[sync/grounding-and-bonding]] apply in addition to this standard.
## This standard does not cover the following, which are specified elsewhere: {note}
- The structural slab and slab leveling beyond the tolerances stated herein.
- The cooling equipment served by the plenum (see [[syncs/computer-room-air-conditioning]]).
+- The cooling equipment served by the plenum (see [[sync/computer-room-air-conditioning]]).
- The cabling and conduit routed within the plenum.
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# Grounding and Bonding {toc}
## A conductive understructure can serve as a signal reference grid and as part of the equipment grounding path; where it does, it shall be bonded in accordance with the National Electrical Code and [[syncs/grounding-and-bonding]]. {note}
+## A conductive understructure can serve as a signal reference grid and as part of the equipment grounding path; where it does, it shall be bonded in accordance with the National Electrical Code and [[sync/grounding-and-bonding]]. {note}
## Where the floor is used as a signal reference grid or equipment grounding path, all non-current-carrying metal parts of the understructure, including pedestals and stringers, shall be bonded to the equipment grounding conductor in accordance with NEC Article 250 and Article 645.
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## This standard was independently authored from public consensus standards, building codes, public-domain federal guide specifications, and professional knowledge, and contains no proprietary guide-specification prose. {note}

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