Telecommunications Bonding and Grounding

Revision 4 · SynC Standards Team — Specifier, SynC (SynC Platform Team / Platform Standards) ✓ Official · Jun 11, 2026 +3 −3

Migrate datasheet deferrals to drawing_ref + default: deferred
Showing changes from Rev 3 to Rev 4 in Telecommunications Bonding and Grounding.
Tag changes −Grounding−Telecommunications
---
title: Telecommunications Bonding and Grounding
282 unchanged lines
- "3/0 AWG"
- "750 kcmil maximum per TIA-607-E"
default: "Per TIA-607-E length-based sizing — see drawings"
+default: deferred
```
48 unchanged lines
- "3/0 AWG"
- "750 kcmil (maximum per TIA-607-E)"
default: "Per TIA-607-E length-based sizing — see drawings"
+default: deferred
```
318 unchanged lines
label: Bonding Grid Conductor Size and Spacing
type: select
+drawing_ref: "equipment manufacturer's grounding plan"
options:
- "6 AWG bare copper, 0.6 m × 0.6 m (2 ft × 2 ft) grid"
- "6 AWG bare copper, 1.2 m × 1.2 m (4 ft × 4 ft) grid"
- "4 AWG insulated copper, 1.2 m × 1.2 m grid"
- "Per equipment manufacturer's grounding plan"
default: "6 AWG bare copper, 0.6 m × 0.6 m (2 ft × 2 ft) grid"
```
333 unchanged lines
## Where the achieved SBB-to-PBB resistance is marginal relative to the acceptance criterion, the Engineer may require re-testing during the warranty period to confirm that the bonding network's integrity has not degraded.

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