Telecommunications Bonding and Grounding
Migrate datasheet deferrals to drawing_ref + default: deferred
Showing changes from Rev 3
to Rev 4
in Telecommunications Bonding and Grounding.
Tag changes
−Grounding−Telecommunications
---
title: Telecommunications Bonding and Grounding
…282 unchanged lines
- "3/0 AWG"
- "750 kcmil maximum per TIA-607-E"
−default: "Per TIA-607-E length-based sizing — see drawings"
+default: deferred
```
…48 unchanged lines
- "3/0 AWG"
- "750 kcmil (maximum per TIA-607-E)"
−default: "Per TIA-607-E length-based sizing — see drawings"
+default: deferred
```
…318 unchanged lines
label: Bonding Grid Conductor Size and Spacing
type: select
+drawing_ref: "equipment manufacturer's grounding plan"
options:
- "6 AWG bare copper, 0.6 m × 0.6 m (2 ft × 2 ft) grid"
- "6 AWG bare copper, 1.2 m × 1.2 m (4 ft × 4 ft) grid"
- "4 AWG insulated copper, 1.2 m × 1.2 m grid"
− - "Per equipment manufacturer's grounding plan"
default: "6 AWG bare copper, 0.6 m × 0.6 m (2 ft × 2 ft) grid"
```
…333 unchanged lines
## Where the achieved SBB-to-PBB resistance is marginal relative to the acceptance criterion, the Engineer may require re-testing during the warranty period to confirm that the bonding network's integrity has not degraded.